electronic thermal conductivity
英 [ɪˌlekˈtrɒnɪk ˈθɜːml ˌkɒndʌkˈtɪvəti]
美 [ɪˌlekˈtrɑːnɪk ˈθɜːrml ˌkɑːndʌkˈtɪvəti]
【电】电子热传导
双语例句
- Traditional epoxy packaging materials are required for higher performance with the micro electronic packaging density increasing. Composites with high thermal conductivity can be fabricated by addition of ceramic particles or fiber into polymers, and can be used as electronic packaging materials.
微电子封装密度的提高对传统环氧塑封料的导热性能提出了更高的要求，将高导热的陶瓷颗粒/纤维材料添加到聚合物塑封材料中可获得导热性能好的复合型电子封装材料。 - To meet the demands of the new generation of electronic information industry, these materials must have outstanding integrated performance including good processing characteristics, high mechanical properties, outstanding heat resistance, high thermal conductivity, favorable electric insulation and low thermal expansion.
在确保材料具备优良的工艺性和力学性能的同时，还必须具有高耐热、高导热、高电绝缘和低膨胀率等性能，以满足电子信息行业的要求。 - W-Cu alloy is a good composite materials for electronic packaging, it combine the low-expansion performance of tungsten and the high thermal conductivity properties of copper, so it has an excellent thermal conductivity and adjustable thermal expansion coefficient.
钨铜合金结合了钨的低膨胀性和铜的高热导性能，是一种具有优良的导热性能和可调节的热膨胀系数的电子封装复合材料。 - Silicon carbide ( SiC) is a promising candidate for applications in high temperature, high voltage, high power electronic devices because of its outstanding properties such as wide band gap, high critical electric field and high thermal conductivity.
SiC半导体由于具有禁带宽度大、临界击穿电场和热导率高等特点，在高温、高压、大功率器件领域具有广阔的应用前景。 - Metal matrix composites ( MMCs) have been of interest in electronic packaging technology due to their good thermal properties, mainly the high thermal conductivity and low coefficient of thermal expansion.
金属基复合材料（MMCs）可以把基体的高热传导性与增强体的低热膨胀系数结合起来，具有良好的综合热物理性能，满足对电子封装材料性能的要求。 - Compared with traditional electronic packaging materials, diamond/ copper composites have higher thermal conductivity, lower relative density, thermal expansion coefficient matching with semiconductor materials, etc., which has gained extensive attention as a new generation of electronic packaging materials.
金刚石/铜复合材料由于具有热导率高、密度低、热膨胀系数与半导体材料相匹配等优点，已经成为广受重视的新一代电子封装材料之一。 - Metal Matrix composites ( MMC) have received substantial attention as Electronic Packaging Material, because of theirs properties: high thermal conductivity and low coefficient of thermal expansion.
金属基复合材料作为电子封装材料，具有高导热、低膨胀的特点。 - Copper alloys are widely applied in electrical and electronic industries, because of their excellent electric conductivity, thermal conductivity and machining properties.
铜合金因其具有优良的导电、导热以及机械性能，在电工电子等行业得到了广泛的应用。 - With the development of electronic, mechanical, aeronautic and aerospace industries, requires imperative demand of developing functional materials with not only high electrical conductivity, thermal conductivity, and excellent mechanical properties, wear-resistant, low coefficient of thermal expansion.
随着机械、电子以及航空航天工业的迅猛发展，迫切要求开发不仅具有良好导电（热）性、而且具有较高机械和耐磨性能，较低热膨胀系数的功能材料。 - The electronic contribution to the thermal conductivity can be deduced from the electrical conductivity through the use of the Wiedemann-Franz law. However, the thermal conductivity due to phonon heat transfer cannot be measured directly.
自由电子引起的热导率可以通过电导率，利用Wiedemann-Franz定律得到，声子引起的热导率目前仍然不能进行实验测量，只能借助其他方法来研究。